Packaging (of Electronic Components) Reports

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Power and Cooling Network Closets in the Healthcare Setting
sponsored by Emerson Network Power
WHITE PAPER: Network closets in the healthcare setting are housing more powerful and critical equipment as hospitals and ambulatory offices rely on these spaces to support an increasing number of business-critical applications such as electronic medical records (EMRs), wireless communications and digital imaging.
Posted: 07 Oct 2010 | Published: 07 Oct 2010

Emerson Network Power

E-Guide: Selecting Server Hardware for SQL
sponsored by Dell and Microsoft SQL
EGUIDE: Read this expert e-guide to discover the hottest in high-performance SQL Server hardware, including a new breed of technologies that can provide multiprocessor power to SQL Server on multiple hosts. Find tips and best practices for choosing server hardware for both virtual and non-virtual SQL environments.
Posted: 09 Feb 2012 | Published: 30 Jan 2012

Dell and Microsoft SQL

Choosing System Architecture and Cooling Fluid for High Heat Density Cooling Solutions
sponsored by Emerson Network Power
WHITE PAPER: High heat in critical spaces compromises availability. This paper discusses the pros and cons of different cooling fluids and system architectures, and explores the role of supplemental cooling technologies as data center densities increase.
Posted: 07 Jul 2009 | Published: 07 Jul 2009

Emerson Network Power

Expert guide to using blades for virtualization
sponsored by Hewlett Packard Company and Intel
EGUIDE: In this expert e-guide from SearchServerVirtualization.com, learn the advantages of using blades for server virtualization. Find out when it makes the most sense and what considerations to evaluate when creating a blade virtualization strategy.
Posted: 14 Jul 2010 | Published: 14 Jul 2010

Hewlett Packard Company and Intel

Rack Powering Options for High Density
sponsored by Schneider Electric
WHITE PAPER: In this APC whitepaper, alternatives for providing electrical power to high density racks in data centers and network rooms are explained and compared as well as defined guidelines for rack power systems that can reliably deliver power to high density loads while adapting to changing needs.
Posted: 01 Apr 2010 | Published: 09 Jul 2009

Schneider Electric

IBM BladeCenter S - Big Benefits for the Small Office
sponsored by IBM
DATA SHEET: The all-in-one configuration of the IBM BladeCenter S makes it a perfect fit in a small office. It integrates servers, storage, networking and I/O into a single chassis, which uses a standard electrical outlet...
Posted: 10 Jun 2008 | Published: 01 Jun 2008

IBM

PowerEdge C8000 Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This brief resource introduces the PowerEdge C8000 4U shared infrastructure chassis that can easily handle multiple workloads to help reduce response times while easing serviceability. Read on to learn more today.
Posted: 23 Jan 2014 | Published: 23 Jan 2014

Dell, Inc. and Intel®

Transcript: Network Visibility: Thinking Outside the Box
sponsored by Ixia
PRESENTATION TRANSCRIPT: Explore how virtualization can challenge network monitoring, and discover a scalable solution that will help improve visibility for effective, scalable, secure network monitoring.
Posted: 03 Mar 2014 | Published: 03 Mar 2014

Ixia

Automated Energy Efficiency for the Intelligent Business
sponsored by Intel Corporation
IT BRIEFING: By replacing aging single-core processor-based servers with new, more energy-efficient servers, you can gain capacity to grow and to increase IT performance using fewer servers. The estimated cost savings from energy and other operating cost efficiencies can pay for new servers in a an estimated 8 months.
Posted: 20 Apr 2009 | Published: 20 Apr 2009

Intel Corporation