Embedded Devices White Papers

(View All Report Types)
Strategies to Capture Greater Value from Systems Engineering
sponsored by IBM
WHITE PAPER: Access this helpful white paper to learn how you can capture greater value from systems engineering by embracing a more holistic approach to manage complexity in both product and process.
Posted: 11 Nov 2013 | Published: 11 Nov 2013

IBM

Improving Traceability and Auditability Across the Development Lifecycle
sponsored by IBM
WHITE PAPER: This white paper explores how IBM® Rational® software integrated offerings can help gain the traceability you need to ensure overall product quality.
Posted: 19 Mar 2010 | Published: 17 Dec 2009

IBM

Agile in the Embedded World
sponsored by IBM
WHITE PAPER: Embedded systems development demands a method that can conform to the constraints and requirements, and that method is Agile development. Access this in-depth resource to learn more about Agile methodology and embedded systems development, as well as why the two work so well together.
Posted: 07 Nov 2013 | Published: 30 Jun 2013

IBM

Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell

What's New with Dell PowerEdge 12th Generation Servers?
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Take a look at this in-depth resource to find out what you need to know about the next generation servers and how you can successfully transition to this latest technology.
Posted: 19 Feb 2014 | Published: 31 May 2012

Dell, Inc. and Intel®

Virtualization Performance of SAP® ERP on the Intel® Xeon® Processor 7500 Series with VMware
sponsored by Intel
WHITE PAPER: Intel® Xeon® processor 7500 series-based servers offer extraordinary new value for virtualizing SAP solutions. They deliver near-native performance for applications running in virtual machines, while providing levels of reliability and scalability never before seen in industry-standard servers. Read this white paper to learn more!
Posted: 10 May 2010 | Published: 05 May 2010

Intel

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

IBM System x3650 M4 Servers Data Sheet
sponsored by IBM and Intel.
WHITE PAPER: Explore this datasheet to learn about a scalable server package that can save your enterprise money without sacrificing speed or availability.
Posted: 07 Jul 2014 | Published: 14 Sep 2013

IBM and Intel.

Intel® Xeon® Processor 5500 Series: An Intelligent Approach to IT Challenges
sponsored by Hewlett Packard Company and Intel
WHITE PAPER: As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with servers that deliver more performance and scalability, more efficiently. Read on to learn more.
Posted: 08 Jul 2009 | Published: 08 Jul 2009

Hewlett Packard Company and Intel

MAXIMIZE THE VALUE OF YOUR APPLICATIONS WITH FUSION MIDDLEWARE
sponsored by Oracle Corporation
WHITE PAPER: This white paper explores the challenges of operating multiple applications simultaneously. Find out how you can improve efficiency and reduce risk with a pre-integrated application infrastructure.
Posted: 02 Aug 2012 | Published: 01 Jun 2010

Oracle Corporation